Metal reinforcement plate, offset processing, bonding processing.
From the offset processing of adhesive tape to the metal reinforcement plate, to the bonding process and complete curing.
Seiko Electric has many years of experience and know-how in the press processing of reinforcement plates to lamination processing. Depending on the application, we perform high-precision offset lamination processing using insulating/conductive adhesives on aluminum and stainless steel (SUS) reinforcement plates that have undergone press processing/etching, preventing adhesive overflow that could cause circuit malfunctions. In addition to reinforcement plate processing, we provide a consistent response from vacuum temporary lamination of supplied wiring boards and adhesive sheets to complete curing after cure, helping to reduce total costs. We have processing achievements in a wide range of fields, including automotive electrical components, smartphones, and camera modules for entertainment robots, so please feel free to consult with us. Product Information: - Precision die-cutting of tapes and films - Punching processing (press processing) - Vacuum lamination processing For more details, please contact us.
